PART |
Description |
Maker |
15-80-0141 A-70567-0005 0015800141 705670005 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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Molex Electronics Ltd.
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15-80-0083 0015800083 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati Molex Electronics Ltd.
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Molex Electronics Ltd.
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15-80-0065 0015800065 70567-0137 A-70567-0137 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati Molex Electronics Ltd.
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Molex Electronics Ltd.
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0015800685 70567-0168 A-70567-0168 15-80-0685 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective P MOLEX Connector
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Molex Electronics Ltd.
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A-70567-0343 15-80-1101 0015801101 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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Molex Electronics Ltd.
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15-47-7736 0015477736 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0015477636 15-47-7636 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
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Molex Electronics Ltd.
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15-80-0283 0015800283 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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Molex Electronics Ltd.
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43045-0213 43045-0214 43045-0212 430450212 43045-1 |
MICRO FIT (3.0) DUAL ROW VERTICAL THRU HOLE HEADER ASSY
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Molex Electronics Ltd.
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0015800449 15-80-0449 |
2.54mm (.100") Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature
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Molex Electronics Ltd.
|
0878352642 87835-2642 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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Molex Electronics Ltd.
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15-47-7750 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin
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Molex Electronics Ltd.
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